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| Design and Layout Capabilities: |
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Quality Standard Board Layout per IPC-D-275
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Commercial to Military Flight level or Customer Specification
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Research and Development
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DC to 1GHz
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Signal Integrity: Analog, Digital and RF
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High Speed, Controlled Impedance
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Rigid Flex, Flex
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Routing: Manual or Auto
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Single to Multi-layer Layout
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Fine Pitch, High Density
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Ball Grid Array
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Thru-hole to Surface Mount Conversion
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Wire Wrap to Printed Circuit Board Conversion
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Reverse Engineering
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Material Specifying, Sourcing and Procurement
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Schematic Capture ANSI or IEEE
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Printed Wiring Fabrication and Assembly
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Drawings per IPC-D-325, Mil-Std or Customer Specification
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Parts List and/or Bill of Materials generation per Customer
Specification File Conversion, Scanning and Digitizing, NC Drill File Generation
Mechanical Layout and Detailing
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